| Feature | Description | |-----------------------|-----------------------------------------------------------------------------| | | 8nm 3D-stacked chip with tensor cores and L3 cache. | | Performance | 177 TOPS (teraflops) of AI compute power, supporting 8K real-time rendering. | | Cooling System | Liquid-cooled graphene-based thermal interface. | | Software Stack | Compatible with PyTorch/TensorFlow, proprietary drivers for DLDSS-177 . | | Target Use Cases | High-fidelity gaming, autonomous vehicles, scientific simulations. |